The wound high frequency inductor is specially designed for high frequency applications on the market. The ceramic structure yields the highest self-resonance frequency and excellent Q values. This non-magnetic inductor also ensures optimal thermal stability, predictability, and consistency. The main function is to filter or with capacitors, resistors and other components of the resonant circuit.
Mentech WINDING high frequency inductor, using ceramic high frequency characteristics and precision winding technology, to produce high consistency, high impedance, high quality factor products. Our products are available in full sizes of 0402, 0603, 0805, 1008 and 1206. The precision can reach ±2%, ±5% and ±10%, and effectively solve the inductance problem caused by small products in SMT patch climbing tin ring, greatly improve the anti-EMI ability. At present, Mentech winding high frequency inductor products can be widely used in 5G mobile phones, Bluetooth headsets, vehicle equipment, MP3/4, speakers, IC modules, LED lights, GPS, LCD display, U disk, remote controller, digital modules and other electronic products.
Characteristics and characteristics of wound inductance
Features:
(1) Flat bottom surface is suitable for surface mount.
(2) Excellent end face strength good soldering.
(3) With high Q value, high impedance characteristics.
(4) Low direct resistance, resistance to high current.
(5) can provide ribbon packaging, easy to automatic assembly.
Product Features:
(1) Suitable for power supply circuit.
(2) Surface mount type.
(3) Appearance and size comply with EIA standards, different sizes are available for selection.
(4) Good soldering and heat resistance, suitable for general welding and welding back.
Application of high frequency inductor wound in communication market
Under the impetus of the 5 g network, high efficiency, rapid and extensive network era, brings to the communications and 3 c market technical reform and technical upgrading opportunities, but also to the passive components manufacturer has brought a greater technical challenge, especially in 5 g communication introduce new band application of radio frequency end, lead to use rf front-end components increase in number, High frequency signal processing also puts forward high performance requirements for front-end components. In addition, in order to pursue the thin, light and cost reduction requirements of the mobile phone market, the front-end integration requirements are increasingly high, accelerating the modularity, resulting in the need for component miniaturization. Therefore, Mentech launched the wire-wound high-frequency Chip Inductor (MCWL), and relying on Mentech's efficient management and mass production advantages, (MCWL) series winding high frequency inductors to achieve large scale production, and monthly output of up to 80KK, Mentech has a significant advantage over other manufacturers in the market to meet the delivery time.
Number is expected to recommend
Mobile application